Wide range of patented die attach related equipment for the Power Electronic field.
Pressure sintering (silver sintering or in the next future copper sintering too) is a die attach heat treatment process applied to a powdered material in order to give it higher strength, integrity and conductivity.
The InLine X-SAM is a new system designed for quality control in power electronics industries. A non-destructive inspection able to simplify the manufacturing process.
P200 W Series is a full-automatic flat press system able to laminate wafers of different dimensions and thickness for high performance die attach applications.
