Die sintering on lead frame for discrete applications

Die sintering on lead frame for discrete applications

An AMX innovative process

Innovating a long-established component can bring significant benefits for the market but it often requires additional effort in testing and prototyping.

AMX guides its customers through this process, helping them succeed in new challenges through this process and succeed in new challenge based on classic design (High-density power drivers, TO packages, QFN devices, and even emerging opto-photonics applications).

AMX’s patented micropunch system enables precise die sintering on complex lead-frame designs.
Any questions?
Contact us for specific process development and testing support.