Years of experience have enabled our specialist to develop refined skills in managing these applications.
Thanks to this know-how, AMX is able to provide comprehensive support throughout the entire assembly process.
Main process workflow is:
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Plasma cleaning of substrates and die backside
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Stencil printing on substrate with custom stencil (3D stencil printing available)
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Drying in a nitrogen (Nâ) oven
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Pick and place of dies over paste using hot tacking process to keep the dies in position
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Sintering in Nâ atmosphere using our Micropunch system or flat tool with buffer materials
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Scanning Acoustic Microscopy (SAM) analysis
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Shear test analysis
AMX is also experienced in assembly and sintering of:
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Spacers
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Gate resistors
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NTC
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Metallized piezoelectric sensors
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Lead frames
Contact us for specific process development and testing support.
