A high trending process

Forming complex multi-layered 3D structures where the entire package, including the dies, sensors, frames, and the second DBC on top, is sintered to optimize bi-directional heat dissipation.

Used in front-end, mid-end, and back-end processes, enabling high-performance and significantly improving time to market.

An AMX innovative process

Clip sintering, Cu foil and other component on top of die top side.

Core application involving the bonding of SiC/IGBT/MOSFET dies to substrates (DBC or AMB). It supports the simultaneous sintering of diverse components (e.g., NTC thermistors, IGBR resistors, clips, spacers, and pillars) within a single production cycle.